1000ct 200g Diamond Micron Powder Ultra-fine Precision Lapping Polishing Compound for Jewelry Molds Thermal Conductive Material
1000ct 200g Diamond Micron Powder Ultra-fine Precision Lapping Polishing Compound for Jewelry Molds Thermal Conductive Material
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Optional Grit Size:
100 120 / 100#: For coarse grinding
230 270 / 240#: For coarse grinding
W50 / 400#: For coarse polishing
W40 / 500#: For coarse polishing
W28 / 600#: For coarse polishing
W20 / 700#: For medium polishing
W14 / 800#: For medium polishing
W10 / 1000#: For medium polishing
W7 / 2000#: For medium polishing
W5 / 3000#: For fine polishing
W3.5 / 5000#: For fine polishing
W2.5 / 7000#: For fine polishing
W1.5 / 10000#: For mirror polishing
W1.0 / 13000#: For mirror polishing
W0.5 / 15000#: For mirror polishing
High grade, high strength, high purity >99.5%
Our synthetic monocrystalline diamond micropowder is produced through advanced static pressure synthesis and precision grading technology. It features high purity, uniform particle size, excellent thermal conductivity, extreme hardness, and superior wear resistance. It is widely used in ultra-precision polishing, lapping, thermal interface material processing, and high-end abrasive applications.
Feature:
1. Extreme Hardness & Wear Resistance: Mohs hardness 10, the hardest material, ensuring efficient material removal and long service life.
2. High Thermal Conductivity: Excellent heat dissipation performance, effectively reducing thermal damage during polishing and processing.
3. High Purity & Stability: Low impurity content, chemically inert, no contamination to workpieces.
4. Uniform Particle Size: Narrow particle size distribution, consistent processing effect, avoiding scratches and surface defects.
5. Self-Sharpening Property: Maintains sharp cutting edges during use, ensuring stable and efficient processing.
Application:
1. Ultra-Precision Polishing: Sapphire, SiC, GaN, ceramic, optical glass, and semiconductor wafers.
2. Thermal Interface Materials: Polishing of diamond heat sinks, AlN, and high-thermal-conductivity ceramic substrates.
3. Abrasive Tools: Manufacturing of diamond polishing pastes, lapping compounds, grinding fluids, and bonded abrasives.
4. Industrial Processing: Polishing of hard alloys, gemstones, natural diamonds, and precision mechanical parts.
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